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TC1305
Dual 150mA CMOS LDO With Select ModeTM Operation, Shutdown and Independent RESET Output
Features
* Extremely Low Supply Current for Longer Battery Life * Select ModeTM Operation: Selectable Output Voltages for High Design Flexibility * Very Low Dropout Voltage * 29VRMS Typical Output Noise * 10sec (Typ.) Wake-Up Time from SHDN * 150mA Output Current per Output * High Output Voltage Accuracy * Power-Saving Shutdown Mode * RESET Output Can Be Used as a Low Battery Detector or Processor Reset Generator * Over Current Protection and Over Temperature Shutdown * Space Saving 10-Pin MSOP Package
General Description
The TC1305 combines two CMOS Low Dropout Regulators and a Microprocessor Monitor in a space saving 10-Pin MSOP package. Designed specifically for battery operated systems, total supply current is typically 120A at full load, 20 to 60 times lower than in bipolar regulators. The TC1305 features selectable output voltages for higher design flexibility. The tri-state SELECT input pin allows the user to select VOUT1 and VOUT2 from 3 different values (2.5V, 2.8V and 3.0V). An active low RESET is asserted when the detected voltage (V DET) falls below the 2.63V reset voltage threshold. The RESET output remains low for 300msec (typical) after VDET rises above reset threshold. When the shutdown controls (SHDN1 and SHDN2) are low, the regulator output voltages fall to zero, RESET output remains valid and supply current is reduced to 20A (typ.) Other key features for the device include ultra low noise operation, fast response to step changes in load and very low dropout voltage (typically 150mV at full load). The device also incorporates both over temperature and over current protection. Each regulator is stable with an output capacitor of only 1F and has a maximum output current of 150mA. The TC1305 is featured in a 10-Pin MSOP package with selective output voltages. Junction Temperature Range -40C to +85C
Applications
* * * * * * * Load Partitioning Battery Operated Systems Portable Computers Medical Instruments Instrumentation Pagers and Cellular/PHS Phones Linear Post-Regulator for SMPS
Device Selection Table
Part Number TC1305R-DVUN Package 10-Pin MSOP
Typical Application
VDET VIN GND 4 SELECT SHDN1 5 1 2 3 10 9 3.3F RESET VOUT2 VOUT1 3.3F 7 6 470pF Bypass (Optional) SHDN2
NOTE: "R" denotes the suffix for the 2.63V VDET threshold. "D" indicates VOUT1 = VOUT2 = 2.5, 2.8, 3.0 (selectable). Other output voltages are available. Please contact Microchip Technology Inc. for details.
TC1305
8
Package Type
10-Pin MSOP
VDET 1 VIN 2 GND 3 SELECT 4 SHDN1 5 10 RESET 9 VOUT2
TC1305
8 VOUT1 7 Bypass 6 SHDN2
2002 Microchip Technology Inc.
DS21526A-page 1
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TC1305
1.0 ELECTRICAL CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
ABSOLUTE MAXIMUM RATINGS*
Input Voltage .........................................................6.5V Output Voltage........................... (-0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 7) Maximum Voltage on Any Pin ......... VIN +0.3V to -0.3V Operating Temperature Range.... -40C < TJ < +125C Storage Temperature Range .............. -55C to +150C
TC1305 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VR + 1V, IL = 100A, C L = 3.3F, SHDN1 > VIH , SHDN2 > VIH, TA = 25C, unless otherwise noted. Boldface type specifications apply for junction temperature of -40C to +125C. Applies to both VOUT1 and VOUT2. Symbol VIN IOUTMAX VOUT TCV OUT VOUT/VIN Parameter Input Operating Voltage Maximum Output Current Output Voltage (VOUT1 and VOUT2) VOUT Temperature Coefficient Line Regulation Min 2.7 150 -- -- -- -- -- Typ -- -- 20 40 0.05 0.5 2 50 100 150 120 0.05 64 600 0.04 10 Max 6.0 -- -- -- 0.35 2 -- 120 240 360 160 0.5 -- -- -- -- Units V mA V Note 1 Per Channel Note 2 Test Conditions
VR - 2.5% VR 0.5% VR + 2.5%
ppm/C Note 3 % % mV (VR + 1V) < VIN < 6V IL = 0.1mA to IOUTMAX (Note 4) IL = 100A IL = 50mA IL = 100mA IL = 150mA (Note 5) SHDN1, SHDN2 = VIH , IL = 0 SHDN1, SHDN2 = 0V FRE 120Hz VOUT = 0V Notes 6, 7 VIN = 5V CIN = 1F, COUT = 4.7F IL = 30mA, (See Figure 4-1) VIN = 5V CIN = 1F, COUT = 4.7F IL = 30mA, (See Figure 4-1)
V OUT/VOUT Load Regulation VIN - VOUT Dropout Voltage
IIN IINSD PSRR IOUTSC V OUTPD tWK
Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Wake Up Time (from Shutdown Mode)
-- -- -- -- -- --
A A dB mA V/W sec
ts
Settling Time (from Shutdown Mode)
--
40
--
sec
Note 1: 2: 3: 4:
The minimum VIN has to meet two conditions: VIN 2.7 and VIN VR + VDROPOUT. VR is the regulator output voltage setting. For example: VR = 2.5V, 2.8V, 3.0V. TC VOUT = (VOUTMAX - VOUTMIN) x 106 VOUT x T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 Thermal Considerations section of this data sheet for more details.
5: 6: 7:
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TC1305
TC1305 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: VIN = VR + 1V, IL = 100A, CL = 3.3F, SHDN1 > VIH, SHDN2 > VIH , TA = 25C, unless otherwise noted. Boldface type specifications apply for junction temperature of -40C to +125C. Applies to both VOUT1 and VOUT2. Symbol TSD TSD eN Parameter Thermal Shutdown Die Temperature Thermal Shutdown Hysteresis Output Noise Min -- -- -- Typ 160 15 200 Max -- -- -- Units C C nVHz IL = 100A, F = 1kHz, COUT1 = C OUT2 = 4.7F, CBYPASS = 0.01F F = 10Hz to 100kHz VIN = 2.7V to 6.0V VIN = 2.7V to 6.0V VIN = 2.7V to 6.0V VIN = 2.7V to 6.0V TA = 0C to +70C TA = -40C to +125C TA = +25C TA = -40C to +125C RESET = Open VDET = VTH to (VTH - 100mV) VDET = VTHMIN, ISINK = 1.2mA VDET = VTHMIN, ISINK = 3.2mA VDET > 1.0V, ISINK = 50A VDET > VTHMAX, ISOURCE = 500A VDET > VTHMAX, ISOURCE = 800A Test Conditions
-- SHDN Input VIH VIL VSELH VSELL VDET VTH IVDET SHDN Input High Threshold SHDN Input Low Threshold SELECT Input HIgh Threshold SELECT Input Low Threshold VDET Voltage Range Reset Threshold Reset Circuit Supply Current Reset Threshold Tempco V DET to Reset Delay Reset Active Time-out Period VOL RESET Output Voltage Low 1.0 1.2 2.59 2.55 -- -- -- 140 -- -- -- 0.8 VDET VDET - 1.5 65 -- VIN - 0.2
29 -- -- -- -- -- -- 2.63 -- 20 30 100 300 -- -- -- -- --
-- -- 15 -- 0.2 6.0 6.0 2.66 2.70 40 -- -- 560 0.3 0.4 0.3 --
VRMS %VIN %VIN V V V V A ppm/C sec msec V
SELECT Input
RESET Output
VOH
Note 1: 2: 3: 4:
RESET Output Voltage High
V
5: 6: 7:
The minimum VIN has to meet two conditions: VIN 2.7 and VIN VR + VDROPOUT. VR is the regulator output voltage setting. For example: VR = 2.5V, 2.8V, 3.0V. TC VOUT = (VOUTMAX - VOUTMIN) x 106 VOUT x T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 Thermal Considerations section of this data sheet for more details.
2002 Microchip Technology Inc.
DS21526A-page 3
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TC1305
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
Pin No. (10-Pin MSOP) 1 2 3 4 5
PIN FUNCTION TABLE
Symbol VDET VIN GND SELECT SHDN1 Description Detected input voltage. VDET and VIN can be connected together. Power supply input. Ground terminal. Tri-state input for setting V OUT1 and VOUT2. SELECT = GND for VOUT1 = VOUT2 = 2.5V, SELECT = VIN for VOUT1 = VOUT2 = 3.0V and SELECT = No connect for VOUT1 = VOUT2 = 2.8V. Shutdown control input for VOUT1. Regulator 1 is fully enabled when a logic high is applied to this input. Regulator 1 enters shutdown when a logic low is applied to this input. During shutdown, regulator output voltage falls to zero, RESET output remains valid. Shutdown control input for VOUT2. Regulator 2 is fully enabled when a logic high is applied to this input. Regulator 2 enters shutdown when a logic low is applied to this input. During shutdown, regulator output voltage falls to zero, RESET output remains valid. Reference bypass input. Connecting a 0.01F to this input further reduces output noise. Regulated voltage output 1. Regulated voltage output 2. RESET Output. RESET = Low when VDET is below the Reset Threshold Voltage. RESET = High when VDET is above the Reset Threshold Voltage.
6
SHDN2
7 8 9 10
Bypass VOUT1 VOUT2 RESET
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TC1305
3.0 DETAILED DESCRIPTION 4.0
4.1
TYPICAL APPLICATIONS
Input and Output Capacitor
The TC1305 is a precision fixed output voltage regulator that contains two fully independent 150mA regulator outputs. The device features separate shutdown modes for low-power operation, and a common bypass pin that can be used to further reduce output noise. The Select ModeTM operation allows the user to select VOUT1 and V OUT2 from three different values (2.5V, 2.8V, 3.0V), therefore providing high design flexibility. The CMOS construction of the TC1305 results to a very low supply current, which does not increase with load changes. In addition, VOUT remains stable and within regulation at no load currents. The TC1305 also features an integrated microprocessor supervisor that monitors power-up, power-down, and brown-out conditions. The active low RESET signal is asserted when the detected voltage VDET falls below the reset voltage threshold (2.63V). The RESET output remains low for 300msec (typical) after V DET rises above the reset threshold. The RESET output of the TC1305 is ensured valid down to VDET = 1V and is optimized to reject fast transient glitches on the monitored power supply line.
The TC1305 is stable with a wide range of capacitor values and types. A capacitor with a minimum value of 1F from VOUT to Ground is required. The output capacitor should have an effective series resistance (ESR) of 0.1 to 10 for a 1F capacitor and 0.01 to 10 for a 10F capacitor. A 1F capacitor should be connected from the VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalums are recommended for applications operating below -20C). When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques.
4.2
Bypass Capacitor
A 0.01F capacitor connected from the bypass input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. If output noise is not a concern, this input may be left unconnected. Larger capacitor values may be used, but result in a longer time period to rated output voltage when power is initially applied.
4.3
Shutdown Mode
Applying a logic high to each of the shutdown pins turns on the corresponding output. Each regulator enters shutdown mode when a logic low is applied in the corresponding input. During shutdown mode, the output voltage falls to zero, and regulator supply current is reduced to 0.5A (max). If shutdown mode is not necessary, the pins should be connected to VIN.
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TC1305
4.4 Select ModeTM Operation 4.6 Turn On Response
The Select ModeTM operation is a tri-state input that allows the user to select VOUT1 and VOUT2 from three different values. By connecting the SELECT pin to GND, both output voltages (VOUT1, VOUT2) supply 2.5V. Connecting the SELECT pin to VIN results in both output channels supplying a fixed 3.0V output. Last but not least, leaving the SELECT pin floating sets both voltages to 2.8V. This output voltage functionality provides high design flexibility and minimizes costs associated with inventory, time-to-market and new device qualifications. The turn on response is defined as two separate response categories, Wake Up Time (tWK) and Settling Time (tS). The TC1305 has a fast Wake Up Time (10sec typical) when released from shutdown. See Figure 4-1 for the Wake Up Time designated as tWK. The Wake Up Time is defined as the time it takes for the output to rise to 2% of the V OUT value after being released from shutdown. The total turn on response is defined as the Settling Time (tS), see Figure 4-1. Settling Time (inclusive with tWK) is defined as the condition when the output is within 2% of its fully enabled value (40sec typical) when released from shutdown. The settling time of the output voltage is dependent on load conditions and output capacitance on VOUT (RC response).
4.5
RESET Output
The microprocessor supervisor of theTC1305 provides accurate supply voltage monitoring and reset timing during power-up, power-down and brown-out conditions. The RESET output is valid to VDET = 1.0V (below this point it becomes an open circuit and does not sink current) and is able to reject negative going transients (glitches) on the power supply line. Transient immunity can further be improved by adding a capacitor close to the VDET pin of the TC1305.
FIGURE 4-1:
WAKE-UP RESPONSE TIME
VIH
SHDN
VIL 98%
tS
VOUT
2% tWK
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TC1305
5.0
5.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Equation 5-1 can be used in conjunction with Equation 5-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.8V 5% VOUT1MIN = 3.0V 2.5% VOUT2MIN = 3.0V 2.5% ILOAD1MAX = 120mA ILOAD2MAX = 120mA TJMAX TAMAX JA = 125C = 55C = 113C/W
Integrated thermal protection circuitry shuts the regulator off when die exceeds approximately 160C. The regulator remains off until the die temperature drops to approximately 145C. Thermal shutdown is intended to protect the device under transient accidental (fault) overload conditions. Thermal Shutdown may not protect the LDO while operating above junction temperatures of 125C continuously. Sufficient thermal evaluation of the design needs to be conducted to ensure that the junction temperature does not exceed 125C.
5.2
Power Dissipation
Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: PD [(VINMAX - VOUT1MIN)] x ILOAD1MAX + [(VINMAX - VOUT2MIN)] x ILOAD2MAX [(3.8 x 1.05) - (3.0 x .975)] x 120 x 10-3 + [(3.8 x 1.05) - (3.0 x .975)] x 120 x 10-3 = 256mW Maximum allowable power dissipation: PD = (TJMAX - TAMAX) JA = (125 - 55) 113 = 620mW In this example, the TC1305 dissipates a maximum of 256mW; below the allowable limit of 620mW. In a similar manner, Equation 5-1 and Equation 5-2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN is found by substituting the maximum allowable power dissipation of 620mW into Equation 5-1, from which VINMAX = 5.6V.
The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation.
EQUATION 5-1:
PD (VINMAX - VOUT1MIN)ILOAD1MAX + (VINMAX - VOUT2MIN)ILOAD2MAX Where: PD = Worst case actual power dissipation VINMAX = Maximum voltage on VIN VOUT1MIN = Minimum regulator output voltage1 ILOAD1MAX = Maximum output (load) current1 VOUT2MIN = Minimum regulator output voltage2 ILOAD2MAX = Maximum output (load) current2 The maximum allowable power dissipation (Equation 5-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (125C), and the thermal resistance from junction-to-air (JA). The MSOP-10 package has a JA of approximately 113C/W when mounted on a four layer FR4 dielectric copper clad PC board.
5.3
Layout Considerations
EQUATION 5-2:
PDMAX = (T JMAX - TAMAX) JA Where all terms are previously defined.
The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower JA and therefore increase the maximum allowable power dissipation limit.
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DS21526A-page 7
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TC1305
6.0
Note:
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Dropout Voltage1 vs. Load Current (SELECT = NC)
0.18 0.16 DROPOUT VOLTAGE (V) 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 0 25 50 75 100 125 150 LOAD CURRENT (mA)
-45C 25C
Dropout Voltage1 vs. Load Current (SELECT = VDD)
0.18 DROPOUT VOLTAGE (V) DROPOUT VOLTAGE (V) 0.16 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 0 25 50 75 100 125 150 LOAD CURRENT (mA)
-45C 25C
Dropout Voltage2 vs. Load Current (SELECT = VDD)
0.25
130C
130C
0.20
130C
0.15
25C
0.10
-45C
0.05
0.00 0 25 50 75 100 125 150 LOAD CURRENT (mA)
Dropout Voltage2 vs. Load Current (SELECT = VDD)
0.25 0.20 0.600 LOAD REGULATION (%) 0.500 0.400
Load Regulation vs. Temperature
150 140
130C
IDD vs. VDD (SELECT = GND)
DROPOUT VOLTAGE (V)
120 IL = 0.1 to 150mA 0.300 0.200 0.100 0.000 -45 IDD (A) 100 80 60 40 20 0 3 -45C 25C
0.15
130C
25C -45C
0.10
0.05
0.00 0 25 50 75 100 125 150 LOAD CURRENT (mA)
-20
5
30
55
80
105 130
3.5
4
TEMPERATURE (C)
4.5 VDD (V)
5
5.5
6
IDD vs. Temperature (SELECT = NC)
140 130 RESET TIMING (sec) 120 IDD (A) VDD = 6.0V 110 100 90 80 -40 VDD = 3.0V 400 350 300 250 200 150 100 50
Reset Active Time vs. Temperature (C)
2.70 2.68 2.66 VCC TRIP POINT (V) 2.64 2.62 2.60 2.58 2.56 2.54 2.52 5 30 55 80 105 125 2.50 -40 -20
VCC Trip Point vs. Temperature (C)
-20
5
30
55
80
105 125
0 -40 -20
5
30
55
80
105 125
TEMPERATURE (C)
TEMPERATURE (C)
TEMPERATURE (C)
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TC1305
6.0 TYPICAL CHARACTERISTICS (CONTINUED)
VOUT1 vs. Temperature (SELECT = VDD)
3.01 3.00 2.99 2.98 3.00
VOUT2 vs. Temperature (SELECT = VDD)
2.81 2.80 2.79 2.99 2.98 VDD = 3.8V & IL = 150mA
VOUT1 vs. Temperature (SELECT = NC)
VDD = 6.0V & IL = 100A VDD = 3.8V & IL = 100mA VDD = 3.8V & IL = 150mA
VDD = 6.0V & IL = 100A VDD = 4.0V & IL = 100A
VOUT2 (V)
VOUT1 (V)
2.97 2.96 2.95 2.94 2.93 2.92 -45
VDD = 6.0V & IL = 100A VDD = 4.0V & IL = 100A
VOUT1 (V)
80 105 130
VDD = 3.8V & IL = 100mA
2.97 2.96 2.95 2.94 2.93
2.78 2.77 2.76 2.75 2.74
-20
5
30
55
80 105 130
2.92 -45
-20
5
30
55
2.73 -45
-20
5
30
55
80 105 130
TEMPERATURE (C)
TEMPERATURE (C)
TEMPERATURE (C)
VOUT2 vs. Temperature (SELECT = NC)
2.81 2.80 2.79 2.51
VOUT1 vs. Temperature (SELECT = GND)
VDD = 6.0V & IL = 100A VDD = 3.5V & IL = 100A VDD = 3.5V & IL = 150mA
2.51 2.50 2.49 2.50 2.49
VOUT2 vs. Temperature (SELECT = GND)
VDD = 3.5V & IL = 100A VDD = 3.5V & IL = 150mA
VDD = 6.0V & IL = 100A VDD = 6.0V & IL = 100A
VOUT2 (V)
VOUT1 (V)
VOUT2 (V)
2.78 2.77 2.76 2.75 2.74 2.73
VDD = 3.8V & IL = 150mA
2.48 2.47 2.46 2.45 2.44 2.43
2.48 2.47 2.46 2.45 2.44 2.43
VDD = 6.0V & IL = 100A
-45 -20
5
30
55
80 105
130
-45 -20
5
30
55
80 105
130
-45 -20
5
30
55
80 105
130
TEMPERATURE (C)
TEMPERATURE (C)
TEMPERATURE (C)
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TC1305
6.0 TYPICAL CHARACTERISTICS (CONTINUED)
Power Supply Rejection Ratio vs. Frequency
0
Power Supply Rejection Ratio vs. Frequency
0
-20
VINDC = 4V VINAC = 100mVP-P VOUTDC = 3V
IOUT = 150mA COUT = 10F Tantalum
-20
VINDC = 4V VINAC = 100mVP-P VOUTDC = 3V
IOUT = 150mA COUT = 10F Tantalum CBYPASS = 0.01F Ceramic
PSRR (dB)
-40
PSRR (dB)
-40
-60
-60
-80
-80
-100 10 100 1k 10k 100k 1M
-100 10 100 1k f (Hz) 10k 100k 1M
f (Hz)
Output Noise
Output Voltage (50mV / div)
10
Line Transient Response
1 Noise (mV/ HZ)
VOUT2 VOUT1
0.1
Input Voltage 2V / div
6V 4V COUT = 10F Ceramic CIN = 0 CBYP = 0.01F ILOAD = 100A VOUT = 3V Time (2s / div)
0.01
COUT1 = COUT2 = 4.7F, CBYPASS = 0.01F, ILOAD = 100A, VIN = 4.0V, VOUT1 = VOUT2 = 3.0V
0.001 0.01
0.1
1
10
100
1000
Frequency (kHz)
Load Transient Response
Output Voltage (50mV / div) Output Current
150mA 100A VIN = 4V VOUT = 3V COUT = 10F Ceramic CBYP = 0.01F Time (100ms / div)
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TC1305
6.0 TYPICAL CHARACTERISTICS (CONTINUED)
Line Transient Response
VOUT2
Output Voltage Output Voltage (20mV / div) (20mV / div)
Output Voltage Output Voltage (20mV / div) (20mV / div)
Line Transient Response
VOUT2
VOUT1
VOUT1
Input Voltage 2V / div
4.6V 3.6V
Input Voltage 2V / div
VIN
VIN 3.6V COUT1 = COUT2 = 1F Tantalum RLOAD = 30k
4.6V
COUT1 = COUT2 = 10F Ceramic RLOAD = 30k
Output Voltage Output Voltage (20mV / div) (20mV / div)
VOUT2
Output Voltage Output Voltage (20mV / div) (20mV / div)
Load Transient Response
Load Transient Response
VOUT2
VOUT1
VOUT1
Output Current
Output Current
COUT1 = COUT2 = 1F Tantalum VIN = 5.5V RLOAD = 30k RL = 30k 100mA
COUT1 = COUT2 = 10F Ceramic VIN = 5.5V RLOAD = 30k RL = 30k
100mA
100A
100A
Output Voltage 1 Output Voltage 2 (20mV / div) (50mV / div)
Output Voltage Output Voltage (20mV / div) (20mV / div)
Load Transient Response
Load Transient Response
VOUT2
VOUT2
VOUT1
VOUT1
Output Current
COUT1 = COUT2 = 10F Ceramic VIN = 5.5V RLOAD = 30k RL = 30k 100mA
Output Current
COUT1 = COUT2 = 1F Tantalum VIN = 5.5V RLOAD = 30k RL = 30k 100mA
100A
100A
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TC1305
6.0 TYPICAL CHARACTERISTICS (CONTINUED)
Thermal Shutdown Response
Thermal Shutdown Response
VOUT 1V / div
VOUT
1V / div
VIN = 6.0V VOUT = 2.5V CIN = 1F COUT = 1F CBYPASS = 470pF
VIN = 6.0V VOUT = 2.8V CIN = 1F COUT = 1F CBYPASS = 470pF
Time (500ms / div)
Time (500ms / div)
Thermal Shutdown Response
Shutdown Response
3.0V
VOUT
VOUT2
1V / div
1V / div
3.0V VOUT1
VIN = 6.0V VOUT = 3.0V CIN = 1F COUT = 1F CBYPASS = 470pF
1V / div
/Shdn1 = /Shdn2 COUT1 = COUT2 = 1F Tantalum VIN = 5.5V RLOAD = 30k
Time (500ms / div)
Time (10ms / div)
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TC1305
7.0
7.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
7.2
Taping Form
Component Taping Orientation for 10-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P Standard Reel Component Orientation for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
10-Pin MSOP
12 mm
8 mm
2500
13 in
7.3
Package Dimensions
10-Pin MSOP
PIN 1
.122 (3.10) .114 (2.90)
.201 (5.10) .183 (4.65)
.012 (0.30) .006 (0.15) .122 (3.10) .114 (2.90) .043 (1.10) MAX. .020 (0.50) .006 (0.15) .002 (0.05)
6 MAX. .028 (0.70) .016 (0.40)
.009 (0.23) .005 (0.13)
Dimensions: inches (mm)
2002 Microchip Technology Inc.
DS21526A-page 13
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TC1305
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DS21526A-page 14
2002 Microchip Technology Inc.
TC1305
Sales and Support
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21526A-page15
TC1305
NOTES:
DS21526A-page16
2002 Microchip Technology Inc.
TC1305
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro (R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified.
2002 Microchip Technology Inc.
DS21526A-page 17
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WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office
2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com
ASIA/PACIFIC
Australia
Microchip Technology Australia Pty Ltd Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Japan
Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Rocky Mountain
2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-7456
China - Beijing
Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104
Korea
Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934
Atlanta
500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307
Singapore
Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850
Boston
2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821
China - Chengdu
Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office Rm. 2401, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-6766200 Fax: 86-28-6766599
Taiwan
Microchip Technology Taiwan 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
Chicago
333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075
Dallas
4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924
China - Fuzhou
Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521
EUROPE
Denmark
Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910
Detroit
Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260
China - Shanghai
Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
Kokomo
2767 S. Albright Road Kokomo, Indiana 46902 Tel: 765-864-8360 Fax: 765-864-8387
France
Microchip Technology SARL Parc d'Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Los Angeles
18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338
China - Shenzhen
Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086
New York
150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335
Germany
Microchip Technology GmbH Gustav-Heinemann Ring 125 D-81739 Munich, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
San Jose
Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955
Hong Kong
Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431
Italy
Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883
Toronto
6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509
India
Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O'Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062
United Kingdom
Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820
03/01/02
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DS21526A-page 18
2002 Microchip Technology Inc.
*A62512SD*

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